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| S. No. | Title | Description | Download |
|---|---|---|---|
| 1 |
Tender No. CSIO/7(82)/2019-Pur |
Code burning in IC chip |
Click here  [880KB] |
| 2 |
Tender No. CSIO/7(175)/2019-Pur |
CMOS MICROSCOPE CAMERA |
Click here [841KB] |
| 3 |
Tender No. CSIO/7(114)/2019-Pur |
As per specifications attached |
Click here [884KB] |
| 4 |
Tender No. CSIO/5(98)/2019-Pur
|
Computation Board Bundle |
Click here [865KB] |
| 5 |
Tender No. CSIO/7(167)/2019-Pur |
AI Developer Kits with specifications attached |
Click here [1028KB] |
| 6 |
Tender No. CSIO/7(5)/2019-Pur |
Dense Wave length Division Multiplexers as per Specifications |
Click here [732KB] |
| 7 |
Tender No. CSIO/3(37)/2019-Pur |
Fabrication of stainless steel housing as per specification and model attached including the operations mentioned in the specification sheet. |
Click here [1037KB] |
| 8 |
Tender No. CSIO/4(95)/2019-Pur |
Thermopile Sensor with mentioned specifications |
Click here [608KB] |
| 9 |
Tender No. CSIO/4(91)/2019-Pur |
Procurement of Medicines as per list attached - regarding Proforma Invoice |
Click here [339KB] |
| 10 |
Tender No. CSIO/4(114)/2019-Pur |
|
Click here [600KB] |
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