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| S. No. | Title | Description | Download |
|---|---|---|---|
| 1 |
Tender No. CSIO/3(19)/2019-Pur |
3 D Scanner |
Click here  [876KB] |
| 2 |
Tender No. CSIO/3(22)/2019-Pur |
Mixed Signal Oscilloscope |
Click here [580KB] |
| 3 |
Tender No. CSIO/3(13)/2019-Pur (PAC) |
OrCAD PCB Design tools having listed rnodules |
Click here [558KB] |
| 4 |
Tender No. CSIO/3(11)/2019-Pur (PAC) |
Fabrication of Family Mould for Fabrication of Components. (Details as per sheet & drawing enclosed.) |
Click here [1568KB] |
| 5 |
Tender No. CSIO/3(1)/2019-Pur |
Vacuum Sputtering Coating System |
Click here [757KB] |
| 6 |
Tender No. CSIO/3(18)/2019-Pur |
Impedance Analyser IM 3570 Detailed Specifications Attached (ANNEXURE A) & Accessories for Impedance Analyser |
Click here [640KB] |
| 7 |
Tender No. CSIO/4(13)/2019-Pur |
UWB Radar |
Click here [562KB] |
| 8 |
Tender No. CSI0/7(69)2019-Pur |
CMOS Microscope Camera |
Click here [1037KB] |
| 9 |
Tender No. CSIO/4(64)/2019-Pur |
Thermal Imaging Camera |
Click here [480KB] |
| 10 |
Tender No. CSIO/4(68)/2019-Pur |
Cloud Service Specification |
Click here [576KB] |
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