Thermal Imaging Core as per Specifications

Tender No. CSIO/5(98)/2019-Pur

Computation Board Bundle

1. Processor Speed- 1.4 Ghz or higher
2. RAM Size- 4GB or higher
3. Micro SD Slot- Yes
4. WiFi and Bluetooth Support- Yes
5. Camera Support- Yes
6. USB Bid Support- Both USB 2.0 and 3.0
7. Power Cable- Standard USB Cable and Power Adapter
8. Storage- 32 GB micro SD Card

(Item at Sr. No. 7 and 8 to be provided as product bundle, the make may be different from OEM)

Tender No. CSIO/5(98)/2019-Pur

Computation Board Bundle with Specifications Attached

Tender No. CSIO/5(98)/2019-Pur

Computation Board Bundle with Specifications Attached

Tender No. CSIO/4(55)/2019-Pur

1. Deuterium UV Lamp 
2. Visible Source Lamp I Unit
3. Labor and Repair Charges

Tender No. CSIO/5(96)/2019-Pur

NVIDIA® Jetson AGX Xavier™ based embedded GPU kit

Tender No. CSIO/4(73)/2019-Pur

Laptop
• Processor Make Intel
• Processor Generation 9th
• Processor Description Intel Core i7
• Graphic Card JVIDIA GTX 16 series 4GB or higher
• Operating System Windows 10
• RAM Size SGB or higher
• Total SSD Capacity 128 GB or higher
• Display Size 15.6 inch
• Display Type Non-Touch
• Display Resolution (Pixels) 1920X1080 or higher
• Carry Case Yes
• OEM Warranty 1 Year or higher

Tender No. CSIO/5(96)/2019-Pur

NVIDIA® Jetson AGX Xavier™ based embedded GPU kit

Tender No. CSIO/4(69)/2019-Pur

Laptop Computer with Specifications Attached

Supply, Installation, Testing, and Commissioning of LoRa based communication network 
(Detailed specifications attached as Annexure - S)